leaded oscillator, vcxo, ttl / hc-mos metal package, full size dip and half dip i212 / i213 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 10/10 specifications subject to change without no tice p age 1 20.7 5.1 max. 6 min. 0.048 0.36 6 min. 5.1 max. 0.36 0.48 7.62 7.62 7.62 15.24 12.6 12.6 12 3 4 4 1 2 3 dimension units: mm i203 package i202 package pin connection 1 control voltage 2 gnd 3 output 4 vcc 12.6 product features: applications: cmos/ttl compatible logic levels server & storage compatible with leadfree processing sonet /sdh rohs compliant 802.11 / wifi t1/e1, t3/e3 note: a 0.01 f bypass capacitor is recommended between vcc (p in 4) and gnd (pin 2) to minimize power supply noise. * frequency, supply, and load related parameters. frequency 51.84 mhz to 170.000 mhz output level hc-mos ttl ?0? = 0.1 vcc max., ?1? = 0.9 vcc min. ?0? = 0.4 vdc max., ?1? = 2.4 vdc min. duty cycle 50% 5% rise / fall time 10 ns max.* output load hc-mos ttl fo < 50 mhz = 10 ttl, fo > 50 mhz = 5 lsttl 15 pf frequency stability see frequency stability table supply voltage see input voltage table, tolerance 10 % current 50 ma max.* control voltage 1.65 vdc 1.5 vdc for vcc = 3.3 vdc, 2.5 vdc 2.0 vdc for vcc = 5.0 vdc slope positive operating see operating temperature table in part number guide storage -55 c to +125 c part number guide sample part number: i212-1bc3-56.000 mhz package operating temperature frequency stability pullability supply voltage frequency i212 - i213 - 1 = 0 c to +70 c f = 20 ppm b = 50 ppm min. 5 = 5.0 vdc - 56.000 mhz 3 = -20 c to +70 c x = 30 ppm c = 100 ppm min. 3 = 3.3 vdc 4 = -30 c to +75 c b = 50 ppm k = 150 ppm min. 2 = -40 c to +85 c c = 100 ppm l = 200 ppm min.
leaded oscillator, vcxo, ttl / hc-mos metal package, full size dip and half dip i212 / i213 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 10/10 specifications subject to change without no tice p age 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4- (sn / cu / ag over ni over kovar base metal). environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code line 2: xxxx (part number detail = i203- xxxx -freq.) line 3: frequency
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